Jennie S. Hwang Forfatter
Visning: Type : Alle | Sprog : Engelsk | Format : Paperback / softback Der vises kun varer på engelsk
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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly (Bog, Paperback / softback, Engelsk)
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.
Levering: Skaffevare (forvent 14 - 30 hverdage)
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