Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
(Bog, Hardback, Engelsk)
Forlag:
Taylor & Francis Ltd
- Type: Bog
- Format: Hardback
-
Sprog:
Engelsk
- ISBN-13: 9781041216919
- Se flere detaljer ▼
Forventes på lager: 15-01-2027
Formater og udgaver
Beskrivelse
Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments has cutting-edge information on how to design, analyze, and test in the small satellite environment.
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Alle detaljer
| Forlag | Taylor & Francis Ltd |
| Forfattere | Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich |
| Type | Bog |
| Format | Hardback |
| Sprog | Engelsk |
| Udgave | 2 ed |
| Udgivelsesdato | 15-01-2027 |
| Første udgivelsesår | 2027 |
| Serie | Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems |
| Illustrationer | 76 Tables, black and white; 203 Line drawings, black and white; 29 Halftones, black and white; 232 Illustrations, black and white |
| Originalsprog | United Kingdom |
| Sideantal | 304 |
| Indbinding | Hardback |
| Forlag | Taylor & Francis Ltd |
| Sideoplysninger | 304 pages, 76 Tables, black and white; 203 Line drawings, black and white; 29 Halftones, black and w |
| Mål | 234 x 156 |
| ISBN-13 / EAN-13 | 9781041216919 |