3D Integration in VLSI Circuits: Implementation Technologies and Applications (Bog, Hardback, Engelsk)
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3D Integration in VLSI Circuits: Implementation Technologies and Applications

(Bog, Hardback, Engelsk)
3D Integration in VLSI Circuits: Implementation Technologies and Applications
Forlag: Taylor & Francis Ltd

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Beskrivelse

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs.

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Alle detaljer

Forlag Taylor & Francis Ltd
Type Bog
Format Hardback
Sprog Engelsk
Udgivelsesdato 24-04-2018
Første udgivelsesår 2018
Serie Devices, Circuits, and Systems
Illustrationer 15 Tables, black and white; 15 Line drawings, color; 100 Line drawings, black and white; 10 Halftones, color; 48 Halftones, black and white
Fagredaktør Katsuyuki (IBM Thomas J. Watson Research Center Sakuma
Originalsprog United Kingdom
Sideantal 217
Indbinding Hardback
Forlag Taylor & Francis Ltd
Serieredaktør Krzysztof (Redlen Technologies Inc. Iniewski
Sideoplysninger 217 pages, 15 Tables, black and white; 15 Line drawings, color; 100 Line drawings, black and white;
Mål 164 x 242 x 18
ISBN-13 / EAN-13 9781138710399