3D Integration in VLSI Circuits: Implementation Technologies and Applications (Bog, Paperback / softback, Engelsk)
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3D Integration in VLSI Circuits: Implementation Technologies and Applications

(Bog, Paperback / softback, Engelsk)
3D Integration in VLSI Circuits: Implementation Technologies and Applications
Forlag: Taylor & Francis Ltd

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Beskrivelse

The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I

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Alle detaljer

Forlag Taylor & Francis Ltd
Type Bog
Format Paperback / softback
Sprog Engelsk
Udgivelsesdato 30-06-2021
Første udgivelsesår 2021
Serie Devices, Circuits, and Systems
Fagredaktør Katsuyuki (IBM Thomas J. Watson Research Center Sakuma
Originalsprog United Kingdom
Sideantal 234
Indbinding Paperback / softback
Forlag Taylor & Francis Ltd
Serieredaktør Krzysztof (Redlen Technologies Inc. Iniewski
Sideoplysninger 234 pages
Mål 234 x 156
ISBN-13 / EAN-13 9781032095547