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Im Mittelpunkt steht das Spannungsverhältnis zwischen einerseits dem herkömmlichen Logikansatz mit Begriffen wie Signatur, Struktur, Wahrheitswert und andererseits dem eher dynamisch ausgerichteten Begriff des Kalküls, also zwischen Semantik und Syntax.
This book describes the optimized implementations of several arithmetic datapath, controlpath... Læs mere
LSI Physical Design explores how algorthims can be used to create a geometric chip layout can be created from an abstract circuit design. The text emphasizes essential, fundamental techniques, ranging from hypergraph partictioning and circuit placement to timing closure.
Invasive TCPAs provide unprecedented energy efficiency for the parallel execution of nested loop programs by avoiding any global memory access such as GPUs and... Læs mere
This book covers the two broad areas of the electronics and electrical aspects of control applications, highlighting the many different types of control systems of relevance to real-life control system design.
This thesis introduces novel and significant results regarding the analysis and synthesis of positive systems, especially under l1 and L1 performance.
Readers will benefit from a new design and analysis framework for multiprocessor real-time systems, which will translate into a significantly enhanced ability to provide formally verified, safety-critical real-time systems at a significantly lower cost.
This book presents a detailed review of high-performance computing infrastructures for next-generation big data and fast data... Læs mere
This book describes the life cycle process of IP cores, from specification to production, including IP modeling, verification, optimization, and protection.
This book constitutes the refereed proceedings of the 10th International Conference on Model Transformation, ICMT 2017, held as part of STAF 2017, in Marburg, Germany, in July 2017. The 9 full papers and 2 short papers were carefully reviewed and selected from 31 submissions.
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.