Direct Copper Interconnection for Advanced Semiconductor Technology
(Bog, Hardback, Engelsk)
Forlag:
Taylor & Francis Ltd
- Type: Bog
- Format: Hardback
-
Sprog:
Engelsk
- ISBN-13: 9781032528236
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Beskrivelse
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
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| Forlag | Taylor & Francis Ltd |
| Forfatter | Dongkai Shangguan |
| Type | Bog |
| Format | Hardback |
| Sprog | Engelsk |
| Udgivelsesdato | 28-06-2024 |
| Første udgivelsesår | 2024 |
| Illustrationer | 21 Tables, black and white; 378 Line drawings, black and white; 20 Halftones, black and white; 398 Illustrations, black and white |
| Fagredaktør | Dongkai Shangguan |
| Originalsprog | United Kingdom |
| Sideantal | 448 |
| Indbinding | Hardback |
| Forlag | Taylor & Francis Ltd |
| Sideoplysninger | 448 pages, 21 Tables, black and white; 378 Line drawings, black and white; 20 Halftones, black and w |
| Mål | 163 x 243 x 33 |
| ISBN-13 / EAN-13 | 9781032528236 |