Electrical Design of Through Silicon Via
(Bog, Paperback / softback, Engelsk)
Forlag:
Springer
- Type: Bog
- Format: Paperback / softback
-
Sprog:
Engelsk
- ISBN-13: 9789401779494
- Se flere detaljer ▼
Bemærk: Kan ikke leveres før jul.
Beskrivelse
This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity.
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Alle detaljer
| Forlag | Springer |
| Type | Bog |
| Format | Paperback / softback |
| Sprog | Engelsk |
| Udgave | Softcover reprint of the original 1st ed. 2014 |
| Udgivelsesdato | 27-09-2016 |
| Første udgivelsesår | 2016 |
| Illustrationer | 249 Illustrations, black and white; IX, 280 p. 249 illus. |
| Fagredaktør | Manho Lee, Jun So Pak, Joungho Kim |
| Originalsprog | Netherlands |
| Sideantal | 280 |
| Indbinding | Paperback / softback |
| Forlag | Springer |
| Sideoplysninger | 280 pages, 249 Illustrations, black and white; IX, 280 p. 249 illus. |
| Mål | 235 x 155 |
| ISBN-13 / EAN-13 | 9789401779494 |