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Forventes på lager: 23-04-2025
This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging.
| Forlag | Springer International Publishing AG |
| Forfattere | Navid Asadizanjani, Himanandhan Reddy Kottur , Hamed Dalir |
| Type | Bog |
| Format | Hardback |
| Sprog | Engelsk |
| Udgivelsesdato | 23-04-2025 |
| Første udgivelsesår | 2025 |
| Serie | Synthesis Lectures on Engineering, Science, and Technology |
| Illustrationer | 43 Illustrations, color; 2 Illustrations, black and white; XIX, 183 p. 45 illus., 43 illus. in color. |
| Originalsprog | Switzerland |
| Sideantal | 183 |
| Indbinding | Hardback |
| Forlag | Springer International Publishing AG |
| Sideoplysninger | 183 pages, 43 Illustrations, color; 2 Illustrations, black and white; XIX, 183 p. 45 illus., 43 illu |
| Mål | 240 x 168 |
| ISBN-13 / EAN-13 | 9783031861017 |