Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
(Bog, Paperback / softback, Engelsk)
- Type: Bog
- Format: Paperback / softback
-
Sprog:
Engelsk
- ISBN-13: 9783662517253
- Se flere detaljer ▼
Bemærk: Kan ikke leveres før jul.
Beskrivelse
This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.
Læsernes anmeldelser (0)
Alle detaljer
| Forlag | Springer-Verlag Berlin and Heidelberg GmbH & Co. KG |
| Forfatter | Qingke Zhang |
| Type | Bog |
| Format | Paperback / softback |
| Sprog | Engelsk |
| Udgave | Softcover reprint of the original 1st ed. 2016 |
| Udgivelsesdato | 23-08-2016 |
| Første udgivelsesår | 2016 |
| Serie | Springer Theses |
| Illustrationer | 81 Illustrations, color; 34 Illustrations, black and white; XV, 143 p. 115 illus., 81 illus. in color. |
| Originalsprog | Germany |
| Sideantal | 143 |
| Indbinding | Paperback / softback |
| Forlag | Springer-Verlag Berlin and Heidelberg GmbH & Co. KG |
| Sideoplysninger | 143 pages, 81 Illustrations, color; 34 Illustrations, black and white; XV, 143 p. 115 illus., 81 ill |
| Mål | 235 x 155 |
| ISBN-13 / EAN-13 | 9783662517253 |