Bemærk: Kan ikke leveres før jul.
Forventes på lager: 30-07-2022
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
| Forlag | ASM International |
| Forfatter | ASM International |
| Type | Bog |
| Format | Paperback / softback |
| Sprog | Engelsk |
| Udgivelsesdato | 30-07-2022 |
| Første udgivelsesår | 2022 |
| Originalsprog | United States |
| Sideantal | 461 |
| Indbinding | Paperback / softback |
| Forlag | A S M International |
| Sideoplysninger | 461 pages |
| Mål | 231 x 286 x 31 |
| ISBN-13 / EAN-13 | 9781627084192 |