Materials for Advanced Packaging
(Bog, Paperback / softback, Engelsk)
Beskrivelse
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
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Alle detaljer
| Forlag | Springer International Publishing AG |
| Type | Bog |
| Format | Paperback / softback |
| Sprog | Engelsk |
| Udgave | Softcover reprint of the original 2nd ed. 2017 |
| Udgivelsesdato | 08-06-2018 |
| Første udgivelsesår | 2018 |
| Illustrationer | 440 Illustrations, color; 260 Illustrations, black and white |
| Fagredaktør | Daniel Lu, C.P. Wong |
| Originalsprog | Switzerland |
| Sideantal | 969 |
| Indbinding | Paperback / softback |
| Forlag | Springer International Publishing AG |
| Sideoplysninger | 969 pages, 440 Illustrations, color; 260 Illustrations, black and white |
| Mål | 157 x 234 x 55 |
| ISBN-13 / EAN-13 | 9783319832098 |