Materials for Advanced Packaging
(Bog, Hardback, Engelsk)
- Type: Bog
- Format: Hardback
-
Sprog:
Engelsk
- ISBN-13: 9783319450971
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Beskrivelse
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
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Alle detaljer
| Forlag | Springer International Publishing AG |
| Type | Bog |
| Format | Hardback |
| Sprog | Engelsk |
| Udgave | 2nd ed. 2017 |
| Udgivelsesdato | 30-12-2016 |
| Første udgivelsesår | 2016 |
| Illustrationer | 440 Illustrations, color; 260 Illustrations, black and white; XVI, 969 p. 700 illus., 440 illus. in color. |
| Fagredaktør | Daniel Lu, C.P. Wong |
| Originalsprog | Switzerland |
| Sideantal | 969 |
| Indbinding | Hardback |
| Forlag | Springer International Publishing AG |
| Sideoplysninger | 969 pages, 440 Illustrations, color; 260 Illustrations, black and white; XVI, 969 p. 700 illus., 440 |
| Mål | 235 x 155 |
| ISBN-13 / EAN-13 | 9783319450971 |