Materials for Advanced Packaging
(Bog, Hardback, Engelsk)
Beskrivelse
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field.
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Alle detaljer
| Forlag | Springer International Publishing AG |
| Type | Bog |
| Format | Hardback |
| Sprog | Engelsk |
| Udgave | 2nd ed. 2017 |
| Udgivelsesdato | 30-12-2016 |
| Første udgivelsesår | 2016 |
| Illustrationer | 440 Illustrations, color; 260 Illustrations, black and white |
| Fagredaktør | Daniel Lu, C.P. Wong |
| Originalsprog | Switzerland |
| Sideantal | 969 |
| Indbinding | Hardback |
| Forlag | Springer International Publishing AG |
| Sideoplysninger | 969 pages, 440 Illustrations, color; 260 Illustrations, black and white |
| Mål | 235 x 155 |
| ISBN-13 / EAN-13 | 9783319450971 |