Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990: Symposium Held April 10–12, 2007, San Francisco, California, U.S.A.
(Bog, Paperback / softback, Engelsk)
Forlag:
Cambridge University Press
- Type: Bog
- Format: Paperback / softback
-
Sprog:
Engelsk
- ISBN-13: 9781107408715
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Beskrivelse
This book provides a forum to exchange advances in materials, processes, integration, and reliability in advanced interconnects and packaging. The book also addresses interconnects for emerging technologies, including 3D chip stacking and optical interconnects, as well as interconnects for optoelectronics, plastic electronics and molecular electronics.
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Alle detaljer
| Forlag | Cambridge University Press |
| Type | Bog |
| Format | Paperback / softback |
| Sprog | Engelsk |
| Udgivelsesdato | 05-06-2014 |
| Første udgivelsesår | 2014 |
| Serie | MRS Proceedings |
| Fagredaktør | Qinghuang (IBM T J Watson Research Center Lin, E. Todd Ryan, Wen-li (National Institute of Standards and Technology Wu, Do Yeung (Seoul National University) Yoon |
| Originalsprog | United Kingdom |
| Sideantal | 358 |
| Indbinding | Paperback / softback |
| Forlag | Cambridge University Press |
| Sideoplysninger | 358 pages |
| Mål | 229 x 152 x 19 |
| ISBN-13 / EAN-13 | 9781107408715 |