Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit B... (Bog, Paperback / softback, Engelsk)
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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

(Bog, Paperback / softback, Engelsk)
Forfatter: Xing-Chang Wei
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
Forlag: Taylor & Francis Ltd

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power

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Alle detaljer

Forlag Taylor & Francis Ltd
Forfatter Xing-Chang Wei
Type Bog
Format Paperback / softback
Sprog Engelsk
Udgivelsesdato 30-06-2020
Første udgivelsesår 2020
Originalsprog United Kingdom
Sideantal 322
Indbinding Paperback / softback
Forlag Taylor & Francis Ltd
Sideoplysninger 322 pages
Mål 234 x 156
ISBN-13 / EAN-13 9780367573669