Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliab... (Bog, Hardback, Engelsk) af S. Liu
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

(Bog, Hardback, Engelsk)
Forfattere: Shen (Huazhong University of Science and Technology Liu, Yong Liu
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
Forlag: John Wiley & Sons Inc

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Beskrivelse

An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.

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Alle detaljer

Forlag John Wiley & Sons Inc
Forfattere Shen (Huazhong University of Science and Technology Liu, Yong Liu
Type Bog
Format Hardback
Sprog Engelsk
Udgivelsesdato 21-10-2011
Første udgivelsesår 2011
Originalsprog United States
Sideantal 576
Indbinding Hardback
Forlag John Wiley & Sons Inc
Sideoplysninger 576 pages
Mål 252 x 175 x 36
ISBN-13 / EAN-13 9780470827802