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Forventes på lager: 15-07-2014
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
| Forlag | Springer-Verlag New York Inc. |
| Forfattere | Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu |
| Type | Bog |
| Format | Hardback |
| Sprog | Engelsk |
| Udgave | 2015 ed. |
| Udgivelsesdato | 15-07-2014 |
| Første udgivelsesår | 2014 |
| Serie | Micro- and Opto-Electronic Materials, Structures, and Systems |
| Illustrationer | 386 Illustrations, color; 111 Illustrations, black and white; XV, 402 p. 497 illus., 386 illus. in color. |
| Originalsprog | United States |
| Sideantal | 402 |
| Indbinding | Hardback |
| Forlag | Springer-Verlag New York Inc. |
| Sideoplysninger | 402 pages, 386 Illustrations, color; 111 Illustrations, black and white; XV, 402 p. 497 illus., 386 |
| Mål | 242 x 159 x 22 |
| ISBN-13 / EAN-13 | 9781461492627 |