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Forventes på lager: 03-08-2023
The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit.
| Forlag | Springer Fachmedien Wiesbaden |
| Forfatter | Ulrich Hilleringmann |
| Type | Bog |
| Format | Paperback / softback |
| Sprog | Engelsk |
| Udgave | 1st ed. 2023 |
| Udgivelsesdato | 03-08-2023 |
| Første udgivelsesår | 2023 |
| Illustrationer | 2 Illustrations, color; 176 Illustrations, black and white |
| Originalsprog | Germany |
| Sideantal | 264 |
| Indbinding | Paperback / softback |
| Forlag | Springer Fachmedien Wiesbaden |
| Sideoplysninger | 264 pages, 2 Illustrations, color; 176 Illustrations, black and white |
| Mål | 240 x 168 |
| ISBN-13 / EAN-13 | 9783658410407 |