Testing of Interposer-Based 2.5D Integrated Circuits (Bog, Paperback / softback, Engelsk) af Ran Wang
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Testing of Interposer-Based 2.5D Integrated Circuits

(Bog, Paperback / softback, Engelsk)
Forfattere: Ran Wang, Krishnendu Chakrabarty
Forlag: Springer International Publishing AG

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Beskrivelse

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

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Alle detaljer

Forlag Springer International Publishing AG
Forfattere Ran Wang, Krishnendu Chakrabarty
Type Bog
Format Paperback / softback
Sprog Engelsk
Udgave Softcover reprint of the original 1st ed. 2017
Udgivelsesdato 09-05-2018
Første udgivelsesår 2018
Illustrationer 102 Illustrations, color; 16 Illustrations, black and white; XIV, 182 p. 118 illus., 102 illus. in color.
Originalsprog Switzerland
Sideantal 182
Indbinding Paperback / softback
Forlag Springer International Publishing AG
Sideoplysninger 182 pages, 102 Illustrations, color; 16 Illustrations, black and white; XIV, 182 p. 118 illus., 102
Mål 235 x 155
ISBN-13 / EAN-13 9783319854618