Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices (Bog, Paperback / softback, Engelsk)
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

(Bog, Paperback / softback, Engelsk)
Forfatter: Ephraim (Portland State University Suhir
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Forlag: Taylor & Francis Ltd

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The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

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Forlag Taylor & Francis Ltd
Forfatter Ephraim (Portland State University Suhir
Type Bog
Format Paperback / softback
Sprog Engelsk
Udgivelsesdato 04-10-2024
Første udgivelsesår 2024
Illustrationer 49 Tables, black and white; 75 Illustrations, black and white
Originalsprog United Kingdom
Sideantal 382
Indbinding Paperback / softback
Forlag Taylor & Francis Ltd
Sideoplysninger 382 pages, 49 Tables, black and white; 75 Illustrations, black and white
Mål 234 x 156
ISBN-13 / EAN-13 9780367635886