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In particular, the work covers active R filters, OTA-C filters, and switched-capacitor filters, including topics such as differential output opamps, sensitivity analysis for passive components, multiple-feedback techniques, double-sampling, and N-path filters.
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The discussion is built from the bottom up: starting with the design and implementation of key photonic devices and building blocks, reviewing networking and... Læs mere
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Three-Phase AC-AC Power Converters Based On Matrix Converter Topology: Matrix-reactance frequency converters concept presents a review of power frequency converters, with special attention paid to converters without DC energy storage.
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Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling.
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This book provides comprehensive coverage of verification and debugging techniques for embedded software, which is frequently used in safety critical applications (e.g., automotive), where failures are unacceptable.
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This 4th edition provides an overview of the recent changes to the 1149.1 standard and the effect of the changes on the work of test engineers. It also describes the latest updates on the supplementary IEEE testing standards.
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This book is a comprehensive guide to assertion-based verification of hardware designs using System Verilog Assertions (SVA). The book makes SVA usable and accessible for hardware designers, verification engineers, formal verification specialists and EDA tool developers.
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This thesis focuses on the dynamics of autonomous Boolean networks, on the basis of Boolean logic functions in continuous time without external clocking.
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These three techniques enable respectively, cascading of radio frequency (RF) and baseband (BB) circuits under an... Læs mere
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In order to address the conflict between testability and security, the authors describe innovative design-for-testability (DFT) computer-aided design (CAD) tools that support security challenges, engineered for compliance with existing, commercial tools.
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Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as... Læs mere