Søgning på underkategorier- og emner:
Bemærk: Kan ikke leveres før jul.
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability.
Bemærk: Kan ikke leveres før jul.
Metamaterials—artificially structured materials with engineered electromagnetic properties—have enabled unprecedented flexibility in manipulating electromagnetic waves and producing new functionalities.
Bemærk: Kan ikke leveres før jul.
Electroactivity in Polymeric Materials provides an in-depth view of the theory of electroactivity and explores exactly how and why various electroactive phenomena occur.
Bemærk: Kan ikke leveres før jul.
Experimental techniques to investigate both materials and PEC device performance are outlined, followed by an overview of the current state-of-the-art in PEC materials and devices, and combinatorial approaches towards the development of new materials.
Bemærk: Kan ikke leveres før jul.
Bismuth-containing compounds comprise a relatively unexplored materials system that is expected to offer many unique and desirable optoelectronic, thermoelectric, and electronic properties for innovative device applications.
Bemærk: Kan ikke leveres før jul.
Ceramic Materials: Science and Engineering is an up-to-date treatment of ceramic science, engineering, and applications in a single, comprehensive text.
Bemærk: Kan ikke leveres før jul.
The Wireless Identification and Sensing Platform (WISP) is the first of a new class of RF-powered sensing and computing systems.
Bemærk: Kan ikke leveres før jul.
This book introduces piezoelectric microelectromechanical (pMEMS) resonators to a broad audience by reviewing design techniques including use of finite element modeling,... Læs mere
Bemærk: Kan ikke leveres før jul.
This 4th edition provides an overview of the recent changes to the 1149.1 standard and the effect of the changes on the work of test engineers. It also describes the latest updates on the supplementary IEEE testing standards.
Bemærk: Kan ikke leveres før jul.
A wide range of topics are covered, including optoelectronic devices, metal–semiconductor junctions, heterojunctions, MISFETs, LEDs, semiconductor lasers,... Læs mere
Bemærk: Kan ikke leveres før jul.
Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as... Læs mere
Bemærk: Kan ikke leveres før jul.
This book is dedicated to the new two-dimensional one-atomic-layer-thick materials such as graphene, metallic chalcogenides, silicene... Læs mere