Chemical-Mechanical Polishing 2000 – Fundamentals and Materials Issues: Volume 613
(Bog, Paperback / softback, Engelsk)
Forlag:
Cambridge University Press
- Type: Bog
- Format: Paperback / softback
-
Sprog:
Engelsk
- ISBN-13: 9781107413146
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Beskrivelse
Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured.
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| Forlag | Cambridge University Press |
| Type | Bog |
| Format | Paperback / softback |
| Sprog | Engelsk |
| Udgivelsesdato | 05-06-2014 |
| Første udgivelsesår | 2014 |
| Serie | MRS Proceedings |
| Fagredaktør | Rajiv K. (University of Florida) Singh, Rajeev Bajaj, Mansour Moinpour, Marc Meuris |
| Originalsprog | United Kingdom |
| Sideantal | 176 |
| Indbinding | Paperback / softback |
| Forlag | Cambridge University Press |
| Sideoplysninger | 176 pages |
| Mål | 229 x 152 x 10 |
| ISBN-13 / EAN-13 | 9781107413146 |