Bemærk: Kan ikke leveres før jul.
An introduction to the Hybrid Systems-in-Foil (HySiF) concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided, several bendable... Læs mere
Bemærk: Kan ikke leveres før jul.
This book reports on the design, fabrication and characterization of a set of flexible electronic components, including on-foil sensors, organic thin-film transistors and ultra-thin chips.
Bemærk: Kan ikke leveres før jul.
This book reports on the design, fabrication and characterization of a set of flexible electronic components, including on-foil sensors, organic thin-film transistors and ultra-thin chips.