Forventes på lager: 12-04-2019
This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems.
| Forlag | Springer Verlag, Singapore |
| Forfatter | John H. Lau |
| Type | Bog |
| Format | Hardback |
| Sprog | Engelsk |
| Udgave | 2019 ed. |
| Udgivelsesdato | 12-04-2019 |
| Første udgivelsesår | 2019 |
| Illustrationer | 342 Illustrations, color; 44 Illustrations, black and white |
| Originalsprog | Singapore |
| Sideantal | 368 |
| Indbinding | Hardback |
| Forlag | Springer Verlag, Singapore |
| Sideoplysninger | 368 pages, 342 Illustrations, color; 44 Illustrations, black and white |
| Mål | 235 x 155 |
| ISBN-13 / EAN-13 | 9789811372230 |