Forventes på lager: 02-06-2023
This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases.
| Forlag | Springer Verlag, Singapore |
| Forfattere | Yongle Wu, Weimin Wang |
| Type | Bog |
| Format | Hardback |
| Sprog | Engelsk |
| Udgave | 2023 ed. |
| Udgivelsesdato | 02-06-2023 |
| Første udgivelsesår | 2023 |
| Illustrationer | 7 Illustrations, color; 686 Illustrations, black and white |
| Originalsprog | Singapore |
| Sideantal | 311 |
| Indbinding | Hardback |
| Forlag | Springer Verlag, Singapore |
| Sideoplysninger | 311 pages, 7 Illustrations, color; 686 Illustrations, black and white |
| Mål | 235 x 155 |
| ISBN-13 / EAN-13 | 9789819914548 |