Forventes på lager: 09-07-2022
This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management.
| Forlag | Springer Verlag, Singapore |
| Forfattere | Xiong Du, Jun Zhang, Gaoxian Li, Yaoyi Yu, Cheng Qian, Rui Du |
| Type | Bog |
| Format | Hardback |
| Sprog | Engelsk |
| Udgave | 2022 ed. |
| Udgivelsesdato | 09-07-2022 |
| Første udgivelsesår | 2022 |
| Serie | CPSS Power Electronics Series |
| Illustrationer | 94 Illustrations, color; 27 Illustrations, black and white |
| Originalsprog | Singapore |
| Sideantal | 172 |
| Indbinding | Hardback |
| Forlag | Springer Verlag, Singapore |
| Sideoplysninger | 172 pages, 94 Illustrations, color; 27 Illustrations, black and white |
| Mål | 235 x 155 |
| ISBN-13 / EAN-13 | 9789811931314 |