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This book provides an introduction to the main design principles, methods, procedures, and development trends in spacecraft power systems. The book’s closing... Læs mere
Bemærk: Kan ikke leveres før jul.
This book provides an introduction to the main design principles, methods, procedures, and development trends in spacecraft power systems. The book’s closing... Læs mere
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This book presents select peer-reviewed proceedings of the International Conference on Frontiers in Smart Systems Technologies (ICFSST 2019).
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The focus is on the current developments in control and signal systems in electrical engineering, and covers various topics such as power systems, energy systems, micro grid, smart grid, networks, fuzzy systems and their control.
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The focus is on the current developments in control and signal systems in electrical engineering, and covers various topics such as power systems, energy systems, micro grid, smart grid, networks, fuzzy systems and their control.
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This book presents state-of-the-art research advances in the field of wireless sensor networks systems and approaches.
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This book discusses key techniques of protection and fault ride-through in VSC-HVDC grids, including high-speed selective protection, DC fault current limitation, converter restarting, and DCCB reclosing strategies.
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This book discusses key techniques of protection and fault ride-through in VSC-HVDC grids, including high-speed selective protection, DC fault current limitation, converter restarting, and DCCB reclosing strategies.
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This book comprises select peer-reviewed papers from the International Conference on VLSI, Communication and Signal processing (VCAS) 2019, held at Motilal Nehru National Institute of Technology (MNNIT) Allahabad, Prayagraj, India.
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This book comprises select peer-reviewed papers from the International Conference on VLSI, Communication and Signal processing (VCAS) 2019, held at Motilal Nehru National Institute of Technology (MNNIT) Allahabad, Prayagraj, India.
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In the second half of the book, the underlying device physics supported by different experimental observations and modelling of RRAM devices are presented with memory array level implementation.
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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.