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This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
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This book demonstrates how to use the Synopsys Sentaurus TCAD 2014 version for the design and simulation of 3D CMOS (complementary metal–oxide–semiconductor) semiconductor nanoelectronic devices, while also providing selected source codes (Technology Computer-Aided Design, TCAD).
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This book is a compilation of selected papers from the 8th International Multidisciplinary Conference on Optofluidics (IMCO 2018) held in Shanghai on August 5-8, 2018, as well as papers from the IMCO 2019 held in Hong Kong on June 14-17, 2019.
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This thesis examines electrode materials such as mesoporous carbons, manganese oxides, iron oxides and their nanohybrids with graphene.
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This thesis focuses on the growth of a new type of two-dimensional (2D) material known as hexagonal boron... Læs mere
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This thesis focuses on the transport and magneto-transport properties of graphene p-n-p junctions, such as the pronounced quantum Hall effect, a well-defined plateau–plateau transition point, and scaling behavior.
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This book is focused on the study of physical mechanisms and device design for achieving high-performance infrared photodetection based on low-dimensional materials.
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This book is primarily designed to serve as a textbook for undergraduate students of electrical, electronics, and computer engineering, but can also be used for primer courses across other disciplines of engineering and related sciences.
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This book deals with mathematical modeling, namely, it describes the mathematical model of heat transfer in a silicon cathode of small (nano)... Læs mere