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Der Autor der Neuauflage brachte das Werk auf den neuesten Stand der Technik und erweiterte es um ein Kapitel über Explosionsfestigkeit von Apparaten und Rohrleitungen und um ein Kapitel über Spannungsbewertung explosionsdruckstoßfesten Bauteilen.
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In diesem Buch werden die Inhalte des Wissenschaftssymposiums „Ur- und Umformen“ der Volkswagen Komponente zusammengefasst. Anschließend wird ein... Læs mere
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For Microelectromechanical Systems (MEMS) and Nanoelectromechanical Systems (NEMS) production, each product requires a unique process technology. Besides,... Læs mere
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Chapter 2 is dedicated to the analysis of orthogonal cutting experiments using diamond-coated tools with force and temperature measurements. Finally, chapter 7 is dedicated to flexible integration of shape and functional modelling of machine tool spindles in a design framework.
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Advances in Metallic Biomaterials
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Das Gebiet der Kolloid- und Grenzflächenchemie und -physik ist ausgesprochen vielschichtig und nahezu für alle Gebiete der Natur- und Lebenswissenschaften sowie der Technik von immenser und stetig zunehmender Bedeutung.
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Starting from a brush-up of the basic quantum mechanics and materials science, the book helps to gradually build up understanding of the various effects of quantum confinement, optical-electronic properties of nanoparticles and major nanomaterials.
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This book presents a computer-aided approach to the design of mechatronic systems. Therefore, a second edition became necessary taking these improvements into account. The modeling is based on system top-down and bottom-up approach.
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Like the previous editions also the third edition of this book combines the detailed physical modeling of mechatronic systems and their precise numerical simulation using the Finite Element (FE) method.
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The technologies for product assembly and manufacturing evolve along with the advancement of enabling technologies such as material science, robotics, machine intelligence as well as information and communication.
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This is the third in a series of compendiums devoted to the subject of weld hot cracking. These hot cracking phenomena include weld solidification cracking, HAZ and weld metal liquation cracking, and ductility-dip cracking.
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This book serves as a guide on photonic assembly techniques. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail.