Shichun Qu Forfatter

Visning: Type : Alle | Sprog : Alle | Format : Alle

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  PRIS

  1.508,- kr

  FRAGTFRI LEVERING

  Levering: Skaffevare (forvent 14 - 30 hverdage)

  Bemærk: Kan ikke leveres før jul.

  Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications (Bog, Hardback, Engelsk)

  Af: Shichun Qu

  Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.

  PRIS

  1.508,- kr

  FRAGTFRI LEVERING

  Levering: Skaffevare (forvent 14 - 30 hverdage)

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