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Interconnect Reliability in Advanced Memory Device Packaging

(Bog, Paperback / softback, Engelsk)
Forfattere: Chong Leong Gan, Chen-Yu Huang
Interconnect Reliability in Advanced Memory Device Packaging
Forlag: Springer International Publishing AG

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Beskrivelse

This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.

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Alle detaljer

Forlag Springer International Publishing AG
Forfattere Chong Leong Gan, Chen-Yu Huang
Type Bog
Format Paperback / softback
Sprog Engelsk
Udgave 2023 ed.
Udgivelsesdato 30-04-2024
Første udgivelsesår 2024
Serie Springer Series in Reliability Engineering
Illustrationer 89 Illustrations, color; 11 Illustrations, black and white
Originalsprog Switzerland
Sideantal 210
Indbinding Paperback / softback
Forlag Springer International Publishing AG
Sideoplysninger 210 pages, 89 Illustrations, color; 11 Illustrations, black and white
Mål 235 x 155
ISBN-13 / EAN-13 9783031267109