Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Bog, Hardback, Engelsk)
  1. Forside
  2. Bøger
  3. Engelske bøger
  4. Satellitkommunikationsteknologi
  5. Ingeniørvidenskab: generelt
  6. Konstruktionsteknik
  7. Rumfartsteknologi og luftfartsteknologi
  8. Miljøvidenskab, miljøteknik og miljøteknologi
  9. Thermal and Structural Electronic Packaging Analysis for Space...

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

(Bog, Hardback, Engelsk)
Forfattere: Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Forlag: Taylor & Francis Ltd

Bemærk: Kan ikke leveres før jul.

Når du handler på WilliamDam.dk, betaler du den pris du ser.

  • Ingen gebyrer
  • Ingen abonnementer
  • Ingen bindingsperioder

Relaterede kategorier

Beskrivelse

This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

Læsernes anmeldelser (0)

Alle detaljer

Forlag Taylor & Francis Ltd
Forfattere Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich
Type Bog
Format Hardback
Sprog Engelsk
Udgivelsesdato 30-12-2021
Første udgivelsesår 2021
Serie Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems
Illustrationer 70 Tables, black and white; 188 Line drawings, black and white; 29 Halftones, black and white; 217 Illustrations, black and white
Originalsprog United Kingdom
Sideantal 290
Indbinding Hardback
Forlag Taylor & Francis Ltd
Sideoplysninger 290 pages, 70 Tables, black and white; 188 Line drawings, black and white; 29 Halftones, black and w
Mål 224 x 243 x 24
ISBN-13 / EAN-13 9781032160818