Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Bog, Paperback / softback, Engelsk)
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

(Bog, Paperback / softback, Engelsk)
Forfattere: Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
Forlag: Taylor & Francis Ltd

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This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

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Forlag Taylor & Francis Ltd
Forfattere Juan Cepeda-Rizo, Jeremiah Gayle, Joshua Ravich
Type Bog
Format Paperback / softback
Sprog Engelsk
Udgivelsesdato 26-08-2024
Første udgivelsesår 2024
Serie Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems
Illustrationer 70 Tables, black and white; 188 Line drawings, black and white; 29 Halftones, black and white; 217 Illustrations, black and white
Originalsprog United Kingdom
Sideantal 290
Indbinding Paperback / softback
Forlag Taylor & Francis Ltd
Sideoplysninger 290 pages, 70 Tables, black and white; 188 Line drawings, black and white; 29 Halftones, black and w
Mål 233 x 157 x 21
ISBN-13 / EAN-13 9781032160856