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Functional Design Errors in Digital Circuits Diagnosis covers a wide spectrum of innovative methods to automate the debugging... Læs mere
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The demand for further improvement in these aspects can only be satis?ed by designing embedded systems of increasing complexity, which in turn necessitates the development of new system design methodologies based on speci?cation, design, and veri?cation languages.
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Developing NoC based interconnect tailored to a particular application domain, satisfying the application performance constraints with minimum power-area overhead is a major challenge.
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Field-programmable gate arrays (FPGAs), which are pre-fabricated, programmable digital integrated circuits (ICs), provide easy access to state-of-the-art integrated circuit process technology, and in doing so, democratize this technology of our time.
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Although there are no widely adhered standards for a design flow, most companies have their own established practices,... Læs mere
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Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes.
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The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood.
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This book presents the necessary analytical and computational tools for MEMS designers to model and simulate most known MEMS devices, structures, and phenomena. In also provides analysis and treatment for the most common static and dynamic phenomena in MEMS.
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This book reviews GPP LTE physical layer and dataflow-based prototyping and programming, focusing on automatic partitioning and scheduling, load balancing and computation latency reduction in systems based on heterogeneous multi-core Digital Signal Processors.
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This book will help engineers write better Verilog/SystemVerilog design and verification code as well as deliver digital designs to market more quickly. It shows over 100 common coding mistakes that can be made with the Verilog and SystemVerilog languages.
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At the same time, the explosive growth of wireless data such as WiFi spurred s- ni?cant research into and development of new architectures for radio transceivers that could deliver very high data rates over short ranges, particularly for video and personal area networks.
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“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives).