Chong Leong Gan Forfatter

Visning: Type : Alle | Sprog : Alle | Format : Alle

• 

  PRIS

  1.932,- kr

  FRAGTFRI LEVERING

  Levering: Skaffevare (forvent 14 - 30 hverdage)

  Bemærk: Kan ikke leveres før jul.

  Interconnect Reliability in Advanced Memory Device Packaging (Bog, Hardback, Engelsk)

  Af: Chong Leong Gan

  This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.

  PRIS

  1.932,- kr

  FRAGTFRI LEVERING

  Levering: Skaffevare (forvent 14 - 30 hverdage)

  Læg i kurv
• 

  PRIS

  1.932,- kr

  FRAGTFRI LEVERING

  Levering: Skaffevare (forvent 14 - 30 hverdage)

  Bemærk: Kan ikke leveres før jul.

  Interconnect Reliability in Advanced Memory Device Packaging (Bog, Paperback / softback, Engelsk)

  Af: Chong Leong Gan

  This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.

  PRIS

  1.932,- kr

  FRAGTFRI LEVERING

  Levering: Skaffevare (forvent 14 - 30 hverdage)

  Læg i kurv