Chong Leong Gan Forfatter
Visning: Type : Alle | Sprog : Engelsk | Format : Paperback / softback Der vises kun varer på engelsk
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Interconnect Reliability in Advanced Memory Device Packaging (Bog, Paperback / softback, Engelsk)
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.
Levering: Skaffevare (forvent 14 - 30 hverdage)
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