Juan Cepeda-Rizo Forfatter
Visning: Type : Alle | Sprog : Alle | Format : Alle
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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Bog, Hardback, Engelsk)
This book provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.
Levering: Skaffevare (forvent 14 - 30 hverdage) -
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Bog, Hardback, Engelsk)
Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical,... Læs mere
Levering: Kan forudbestilles (Forventes d. 15-01-2027)
