John Lau Forfatter
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3D IC Integration and Packaging (Bog, Hardback, Engelsk)
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications
Levering: Skaffevare (forvent 14 - 30 hverdage) -
Through-Silicon Vias for 3D Integration (Bog, Hardback, Engelsk)
This professional book focuses on the latest cost- and space-saving methods of 3D integrated circuits—essential for the development of low-cost, high-performance electronic and optoelectronic products.
Levering: Skaffevare (forvent 14 - 30 hverdage) -
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Bog, Hardback, Engelsk)
Unique global coverage of RoHS-compliant materials for electronics manufacturing and for packaging assembly and semiconductor integration
Levering: Skaffevare (forvent 14 - 30 hverdage) -
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration (Bog, Hardback, Engelsk)
This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.
Levering: Skaffevare (forvent 14 - 30 hverdage)
